國立陽明交通大學 電子物理系
National Yang Ming Chiao Tung University
Department of Electrophysics
NYCU
Faculty
Kuan-Neng Chen
Jointly Appointed Professor
Ph.D., Department of Electrical Engineering and Computer Science
Tel.
(03) 5131558
Biography
Experience
Publications
Awards
Massachusetts Institute of Technology Cambridge, MA
Ph.D., Department of Electrical Engineering and Computer Science
M.S., Department of Materials Science and Engineering
2020
NAI Fellow (National Academy of Inventors) “have demonstrated a highly prolific spirit of innovation in creating or facilitating outstanding inventions that have made a tangible impact on the quality of life, economic development, and the welfare of society.”
2018
IEEE Fellow “for contributions to 3D integrated circuit and packaging technologies”
2020
IET Fellow
2021
IMAPS Fellow
2021 -
Program Director, Micro-Electronics Program, Ministry of Science and Technology (Taiwan)
2021 -
Chair Professor, Institute of Electronics, National Yang Ming Chiao Tung University.
2021 -
Adjunct Professor, Institute of Physics, National Yang Ming Chiao Tung University.
2019 -
Vice President for International Affairs, National Chiao Tung University/ National Yang Ming Chiao Tung University
2017 -
Specially Appointed Professor, Institute of Innovative Research, Tokyo Institute of Technology.
2015 -
Associate Dean, International College of Semiconductor Technology, National Yang Ming Chiao Tung University.

Book Chapter

  1. Kuan-Neng Chen, Ting-Yang Yu, Yu-Chen Hu, and Cheng-Hsien Lu, “Novel Platforms and Applications Using Three-Dimensional and Heterogeneous Integration Technologies”, in 3D Integration in VLSI Circuits, CRC Press, ISBN 9781138710399, Apr. 2018.
  2. 柯正達,陳裕華,陳冠能,“第五章 先進封裝電子材料”,電子材料導論,ISBN 978-986-412-927-0,高立圖書, Mar 2013.
  3. Kuan-Neng Chen, Hsiang-Lan Lung, Yu Zhu, Huai-Yu Cheng, and Frederick T. Chen, “Phase Change Materials: Research Developments and Device Applications”, in Nonvalotile Memories:Materials, Devices and Applications, American Scientific Publisher, ISBN 978-1588832504, Mar.2012.
  4. Kuan-Neng Chen, and Chuan Seng Tan, “Chapter 9 Thermo-Compression Cu-Cu Bonding of Blanket and Patterned Wafers”, in Handbook of Wafer Bonding, Wiley VCH, ISBN 9783527326464, Jan 2012.
  5. 陳冠能, 陳裕華, 鄭裕庭,“第十三章 三維積體電路製程”,新世代積體電路製程, ISBN 978-957-483-671-0, 東華書局, Sep 2011.
  6. Kuan-Neng Chen, Chuan Seng Tan, Andy Fan, and L Rafael Reif, “Chapter 6 Cu wafer bonding for 3D-ICs application”, in Wafer Level 3-D ICs Process Technology, ISBN 978-0-387-76532-7, Springer, Sep 2008.

 

Journal & Invited

  1. Chia-Hsin Lee, Baron Huang, Jennifer See, Luke Prenger, Yu-Min Lin, Wei-Lan Chiu, Ou-Hsiang Lee, and Kuan-Neng Chen, “Study of Bondable Laser Release Material Using 355 nm Energy to Facilitate RDL-first and Die-first Fan-Out Wafer-Level Packaging (FOWLP)”, To be published in IEEE Transactions on Components, Packaging and Manufacturing Technology.
  2. Leh-Ping Chang, Jian-Jie Wang, Tzu-Heng Hung, Kuan-Neng Chen, and Fan-Yi Ouyang, “Direct metal bonding using nanotwinned Ag films with (1 1 1) surface orientation under air atmosphere for heterogeneous integration”, Applied Surface Science, 576 (B), 151845, Feb 2022.
  3. [Invited Paper] Han-Wen Hu, and Kaun-Neng Chen, “Development of low temperature Cu-Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)”, Microelectronics Reliability, 127, 114412, Nov. 2021.
  4. Yi-Chieh Tsai, Yi-Cheng Huang, Yu-Ting Huang, Han-Wen Hu, and Kuan-Neng Chen, “Investigation of Metal Interconnect for Wafer-level and Sealable Miniaturized MEMS Encapsulation”, IEEE Transactions on Electron Devices, 68(11), pp. 5779-5783, Nov. 2021.
  5. Demin Liu, Po-Chih Chen, Tzu-Chieh Chou, Han-Wen Hu, and Kuan-Neng Chen, “Demonstration of Low-Temperature Fine-Pitch Cu/SiO2 Hybrid Bonding by Au Passivation”, IEEE Journal of Electron Devices Society, 9, pp. 868-875, Oct. 2021
  6. Demin Liu, Po-Chih Chen, Yu-Wei Liu, Han-Wen Hu, and Kuan-Neng Chen, “Low-Temperature (70°C) Cu-to-Cu Direct Bonding by Capping Metal Layers”, IEEE Electron Devices Letters, 42(10), pp. 1524-1527, Oct. 2021.
  7. Yu-Wei Liu, Han-Wen Hu, Ping-Yi Hsieh, Hao-Tung Chung, Shu-Jui Chang, Jui-Han Liu, PoTsang Huang, Chih-Chao Yang, Chang-Hong Shen, Jia-Min Shieh, Kuan-Neng Chen, and Chenming Hu, “Single-crystal islands (SCI) for monolithic 3D and back-end-of-line FinFET circuits”, IEEE Transactions on Electron Devices, 68(10), pp. 5257-5262, Oct. 2021.
  8. Jun-Dao Luo, Yu-Ying Lai, Kuo-Yu Hsiang, Chia-Feng Wu, Hao-Tung Chung, Wei-Shuo Li, ChunYu Liao, Pin-Guang Chen, Kuan-Neng Chen, Min-Hung Lee, and Huang-Chung Cheng, “Atomic Layer Deposition Plasma-Based Undoped-HfO2 Ferroelectric FETs for Non-Volatile Memory”, IEEE Electron Devices Letters, 42(8), pp. 1152-1155, Aug. 2021.
  9. Yi-Chieh Tsai, Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Han-Wen Hu, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba, and Kuan-Neng Chen, “Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via”, IEEE Transactions on Electron Devices, 68(7), pp. 3520-3525, Jul. 2021.
  10. Demin Liu, Tsung-Yi Kuo, Yu-Wei Liu, Zhong-Jie Hong, Ying-Ting Chung, Tzu-Chieh Chou, HanWen Hu, and Kuan-Neng Chen, “Investigation of Low Temperature Cu-Cu Direct Bonding with Pt Passivation layer in 3D Integration”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 11(4), pp. 573-578, Apr. 2021.
2021
National Industrial Innovation Award, Ministry of Economic Affairs, 2021.
2021
William D. Ashmon – John A. Wagnon Technical Achievement Award, IMAPS, 2021.
2021
NYCU Outstanding Industry-Academia Cooperation Achievement Award, 2021.
2021
Excellent Teaching Award, College of EE, NYCU, Oct 2021.
2021
MOST Outstanding Research Award, Ministry of Science and Technology, 2021.
2020
NCTU Outstanding Industry-Academia Cooperation Achievement Award, 2020.
2020
Excellent Teaching Award, NCTU, Jun 2020.
2019
Futuristic Breakthrough Technology Award, Future Tech (MOST), 2019.
2018
IEEE EPS Exceptional Technical Achievement Award, IEEE Electronics Packaging Society, 2018. “For contributions to 2.5D and 3D IC heterogeneous integration, with focus on interconnect technologies.”
2018
MOST Outstanding Research Award, Ministry of Science and Technology, 2018