Faculty
Tien-Sheng Chao
Professor
Ph.D. in Electronic Engineering, National Chiao Tung University
Office
Science Building III, SC 306
Tel.
(03) 5131367
Lab.
Advanced Semiconductor Device Laboratory
Science Building III, SC 704, 706 Ext. 56115
Biography
Experience
Expertise
Publications
1988 - 1992
Ph. D. Institute of Electronics Engineering, NCTU, Taiwan
1987 - 1988
M. S. Institute of Electronics Engineering, NCTU, Taiwan
1981 - 1985
B. S. Dept. of Electrical and Electronics Engineering, NCTU, Taiwan
2021/02 -
Professor, Department of Electrophysics, National Yang Ming Chiao Tung University
2009/08 - 2011/07
Chairman, Department of Electrophysics, National Chiao Tung University
2002/08 - 2021/01
Professor, Dept. Of Electrophysics, National Chiao Tung University
2001/08 - 2002/07
Associate Professor, Dept. Of Electrophysics, National Chiao Tung University
1992 - 2001
Associate Researcher / Researcher, National Nano Device Labs
  1. Physics of Semiconductor Devices
  2. Thin Films Deposition Techniques
  3. ULSI Technology
  4. Deep-Submicron Devices Fabrications
  5. Ultra-thin Oxide Preparations
  6. Ultra-clean Processes.
  1. Y. Lee, C. C. Lee, Y. S. Kuo, S. W. Li, and T. S. Chao*, “Ultrathin Sub-5-nm Hf1-xZrxO2 for a Stacked Gate-all-Around Nanowire Ferroelectric FET With Internal Metal Gate,” IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 9, pp. 236-241, 2021.
  2. S. Kuo, S. Y. Lee, C. C. Lee, S. W. Li, T. S. Chao*, “CMOS-Compatible Fabrication of Low-Power Ferroelectric Tunnel Junction for Neural Network Applications,” IEEE TRANSACTIONS ON ELECTRON DEVICES, 68(2), pp. 879-884, 2021.
  3. H. Shen, W. Y. Chen, S. Y. Lee, P. Y. Kuo, and T. S. Chao*, “Nitride Induced Stress Affecting Crystallinity of Sidewall Damascene Gate-All-Around Nanowire Poly-Si FETs,” IEEE TRANSACTIONS ON NANOTECHNOLOGY, 19, pp.322-327, 2020.
  4. Y. Lee, H. W. Chen, C. H. Shen, P. Y. Kuo, C. C. Chung, Y. E. Huang, H. Y. Chen, and T. S. Chao*, “Effect of Seed Layer on Gate-All-Around Poly-Si Nanowire Negative-Capacitance FETs With MFMIS and MFIS Structures: Planar Capacitors to 3-D FETs,” IEEE Trans. On Electron Devices, 67 (2), pp. 711-716, 2020.
  5. Y. Lee, H. W. Chen, C. H. Shen, P. Y. Kuo, C. C. Chung, Y. .E. Huang, H. Y. Chen, T. S. Chao* , ” Experimental Demonstration of Stacked Gate-All-Around Poly-Si Nanowires Negative Capacitance FETs with Internal Gate Featuring Seed Layer and Free of Post-Metal Annealing Process,” IEEE Electron Device Letters, 40 (11), 1708-1711, 2019.
  6. C. Chung, C. M. Ko, and T. S. Chao*, “Self -Limited Low-Temperature Trimming and Fully Silicided S/D for Vertically Stacked Cantilever Gate-All-Around Poly-Si Junctionless Nanosheet Transistors,” IEEE J. OF the Electron Devices Society, 7, 959-963, 2019.
  7. R. Hsieh, K. C. Lin, and T. S. Chao*, ” Investigation of Nitrous Oxide Nitridation Temperatures on P-Type Pi-Gate Poly-Si Junctionless Accumulation Mode TFTs,” IEEE J. OF the Electron Devices Society, 7(1), pp. 282-286, 2019.
  8. Y. Lin, C. Y. Tsai, C. H. Shen, C. C. Chung, M. P. V. Kumar, and T. S. Chao*,”Variable-Channel Junctionless Poly-Si FETs: Demonstration and Investigation With Different Body Doping Concentrations,” IEEE Electron Dev. Letters, 39(9), pp.1326-1329, 2018.
  9. P. V. Kumar, Y. J. Lin, K. H. Kao, and T. S. Chao*, “Junctionless FETs With a Fin Body for Multi-V-TH and Dynamic Threshold Operation,” IEEE Trans. On Electron Devices, 65 (8), pp. 3535-3542, 2018.
  10. H. Shen, P. Y. Kuo, C. C. Chung, S. Y. Lee, and T. S. Chao*, “Stacked Sidewall-Damascene Double-Layer Poly-Si Trigate FETs With RTA-Improved Crystallinity,” IEEE Electron Dev. Letters, 39(4), pp.512-515, 2018.
  11. Chris C. C. Chung, C. H. Shen, J. Y. Lin, C. C. Chin, and S. Chao*, “Vertically Stacked Cantilever n-Type Poly-Si Junctionless Nanowire Transistor and Its Series Resistance Limit,” IEEE Trans. On Electron Devices, 65 (2), pp. 756-762, 2018.
  12. R. Hsieh, Y. D. Chan, P. Y. Kuo, and T. S. Chao*, “Investigation of Channel Doping Concentration and Reverse Boron Penetration on P-Type Pi-Gate Poly-Si Junctionless Accumulation Mode FETs,” IEEE J. of The Electron Dev. Soc., 6(1), pp. 314-319, 2018.
  13. Y. Lin, M. P. V. Kumar, and T. S. Chao*, “Junctionless Nanosheet (3 nm) Poly-Si TFT: Electrical Characteristics and Superior Positive Gate Bias Stress Reliability,” IEEE Electron Dev. Letters, 39(1), pp.8-11, 2018.